What?
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Designed and fabricated electronics to connect off-the-shelf camera sensors to a on-board computer (OBC)
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Built motherboard for SOC (system-on-chip) with Ethernet, USB, UART, SPI, I2C and wireless (XBee) communication
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Switching of LVDS lines between camera sensors
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Tested and validated boards for space applications
How?
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Reverse-engineered camera sensor power and communication lines to be able to switch between 2 sensors and only 1 camera processing board (due to space constraints)
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Built LVDS breakout boards to test different configurations
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Applied LVDS PCB routing guidelines to guarantee signal integrity
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Optimized motherboard PCB layout and connectors position to cable different sensors with very limited space
Results
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Stable switching of camera sensors that reliably produced full images
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Boards built and assembled inside telescope camera assembly
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Boards tested in a thermal vacuum chamber replicating the thermal cycles expected by the satellite AAReST during its mission in low earth orbit
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Boards certified for space application (TRL 8) after successful thermal, vacuum, vibration, and shock tests
